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Intel's Six Technological Strategies for

Time: 2018-12-26    Source: Home station    Click: 3076   

[Brief]In this article, we take stock of Intel this Open Day of breaking point information on the future of the computer industry what impact it will bring.

In recent years, with the continuous improvement and innovation of computer chips, the performance of processors has doubled. At the just-concluded Intel Architecture Day, Intel demonstrated a series of 10-nm-based systems in its research and development, and shared technical strategies in engineering areas, including advanced manufacturing processes and 3D packaging solutions, new architectures for accelerating AI computing, and so on. This article is to take stock of the impact that the bursting information of this open day will have on the computer industry in the future.
On December 12, the blue-topped White-body house in Los Altos, California, across the ocean, leaked the news of shaking the chip industry. Raja Koduri, Senior Vice President of Intel's Processor Core and Visual Computing, and Jim Keller, Senior Vice President and General Manager of Silicon Engineering, gathered with a number of industry leaders to focus on three more widely distributed computing architectures, including CPU and GPU. The structure will mix more elements and more flexible computing power.


Raja Koduri, Senior Vice President of Intel

1. Processing - possessing leading technology is still the key to building leading products. Advanced packaging solutions to expand transistor density in three-dimensional space will give Intel an exponential level of enhanced computing density.
2. Architecture - In the future, Intel will deploy a combination of scalar, vector, matrix and spatial computing architectures into CPU, GPU, accelerator and FPGA chips through advanced packaging and system integration technologies, and release powerful capabilities through scalable software stacks.
3. Memory-large-capacity, high-speed storage is critical for the next generation of computing workloads. Intel has a unique advantage that it can combine the internal memory chip with Intel's proud technology to fill the gap in memory level, thus providing bandwidth closer to the silicon chip.
4. Ultra-micro interconnection - communication technology is as big as wireless connection for 5G infrastructure, and as small as chip-level packaging and bare chip interconnection. Only by providing comprehensive leading interconnection products can large-scale heterogeneous computing be realized.
5. Security - With the emergence of security threats, more reliable security strategies can be established using Intel's various components. Intel has a unique advantage in providing security technology, helping to achieve end-to-end overall improvement, and making security a key differentiating factor.
6. Software - For each order of magnitude of performance improvement potential of the new hardware architecture, software can bring two orders of magnitude of performance improvement. For developers, having a common toolkit that makes good use of Intel chips is critical to achieving exponential scaling of performance.


Intel demonstrated several 10-nm-based systems in development. Due to the change of computing industry, Intel will be more and more flexible in architecture design in the future. In the face of computing adaptation in different scenarios, more computing concepts besides CPU and GPU will be introduced in the future to form the xPU ecosystem.

New Micro Architecture and Packaging Technologies
The degree of processing technology of processors plays an important role in computing density. The most general understanding of computer processors is also clear that the smaller the nanometer (nanometer) value of the manufacturing process, the more transistors are integrated within the processor, and the more functions and performance the processor is endowed with.


Intel launched a new generation of CPU microarchitecture Sunny Cove and the industry's first new Foveros 3D stack packaging technology. The first Foveros product will integrate high-performance 10nm computing stack "chip combination" and low-power 22FFL basic chips. It announced that it is expected to launch a series of products using Foveros in the second half of 2019. The processor based on the new Sunny Cove microarchitecture optimizes AI computing, introduces VNNI framework and develops a new instruction set for in-depth learning, which makes AI learning faster.
Intel processors with new packaging technology, new manufacturing technology, smaller nm value and more powerful performance are expected to attack as soon as the second half of next year! It will cover the next generation of Intel 6550

Renewal of 11 Generations of Collection Display and Announcement of "Xe" Unique Display
At present, Intel mainstream CPU products use the 9th generation of display. Because of the poor performance test in the 10th generation of display research and development, Intel decided to accelerate the development of the new generation of display. With the help of Jim Keller, known as "the godfather of chips", Intel completed the 11th generation of display research and development with 1 trillion floating-point operations per second (1TFLOPS).


Intel's new 11th-generation integrated display architecture has greatly improved its performance compared with the current mainstream 9th-generation integrated display architecture, further enhancing the fluency of integrated display game playing. In addition, the 11th generation will use industry-leading media encoders and decoders to support 4K video streaming and 8K content creation under limited power quotas.


It is worth mentioning that Intel has also released Xe independent graphics cards on Architecture Day, in addition to the new episodes. Firstly, consolidate the market and then redeploy the market. Are you aware of Jim Keller's killing tactics against the "future core market"?
Intel Official Xuan -- "Xe" to lead the market again! Behind the bold words, there must be "hard" technical support. Don't be grumpy, bear with it. We can't eat hot tofu in a hurry. Let's look forward to it together.

Data Age Needs Large Capacity, High Speed Storage and Super Micro-interconnection Support
With the help of powerful computing power of processors, the generation, integration and analysis of all kinds of big data in people's lives can be better solved, and people's future life will become more data-based and intelligent.


High-capacity, high-speed storage is critical for the next generation of computing workloads. Intel can combine internal memory chips with Intel's proud technology to fill the gap in memory level, thus providing bandwidth closer to silicon chips.


In the era of interconnection of all things, how to transmit real-time data and achieve efficient large data transmission is a big problem. Intel provides a powerful impetus for accelerating the development of communication technology, ranging from wireless connection oriented to 5G infrastructure to chip-level packaging and bare chip interconnection, providing comprehensive leading interconnection products to achieve large-scale heterogeneous computing patterns.
With the above storage scheme, technology and hardware support, AI can be implemented and applied to all areas of people's lives. Taking AI medical treatment as an example, this hospital generates the patient's medical records and uploads them to the server through high-speed data transmission. The other hospital can quickly obtain the patient's past morbidity and allergic status of which drugs it takes, and make timely appropriate medical diagnosis, prescribe drugs or arrange medical treatment.

Convenient Software Support Enhances Performance of New Architecture Processors
A series of 10-nm-based systems developed by Intel in collaboration with software developers were demonstrated. Through the combination of hardware and software, the CPU performance of the new hardware architecture can be improved by two data levels. Having a versatile toolkit that makes good use of Intel chips is critical for technology developers.


The new SunnyCove microarchitecture Core and to strong processors will first meet you, and it will appear in 10 nanometers. Its performance will overturn the chip industry, after all, it has advanced manufacturing technology and 3D packaging solutions. In addition, Sunny Cove microarchitecture processors optimize AI computing and learning capabilities to further speed up the era of interconnection.
In recent years, the "Moore's Law" has been declining in the workshop. After reading so much information about Intel's "Architecture Day" mentioned above, do you believe in the "loss" statement? Raja Koduri's response to questions at this meeting may be more thoughtful: the essence of Moore's Law is to continue to provide new technologies and capabilities to meet the needs of modern computing. The implication is not only about transistors, but also about transistors, architecture research, connectivity improvement, faster memory systems and software integration to promote the chip forward.
In any case, the introduction of new micro-architecture hardware will bring new changes to the computer industry. Are you ready for the big move of Intel?

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